❶ External Visual Inspection
Appearance testing refers to confirming the number of chips received, inner packaging, humidity indication, desiccant requirementsand appropriate outer packaging. Secondly,conduct visual inspection on a single chip, mainly including the chip's typing, year, country of origin, whether it has been repainted, the status of the pins, hether there are regrinding marks, unknown residues, and the location of the manufacturer's logo.
inspection equipment:
❷ X-Ray detection
X-ray testing is a real-time non-destructive analysis to inspect the hardware components inside components, mainly checking the chip's pin frame, wafer size, wire binding diagram,ESD damage and holes. Customers can provide high-quality products for comparative inspection.
Application scope:
Detection of internal cracks and foreign objects in metal materials and components,plastic materials and components, electronic components, electronic components, LED etc., analysis ofinternal displacement in BGA, circuit boards, etc; Discriminate and analyze BGA welding defect such as empty welding and faulty welding.
X-Ray detection images:
Image of X-ray detection equipment:
❸ Decansulation test
Opening the cover (unsealing) mainly uses an instrument to corrode the packaging on the surface of a chip, check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, copyright year, and wafer code, and determine the authenticity of the chip.
Application scope: Verification of chip authenticity and failure analysis, etc.
Cover opening test image:
Image of Cover Opening Test
❹ Electrical Test
According to the device pins and relevant instructions specified by the manufacturer in the specification book, use a semiconductor transistor characteristic graph to check whether the chip is damaged through open circuit and short circuit tests.
Electrical performance test images:
Image of Cover Electrical Test:
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